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Since the establishment, the company has been committed to the prospective development of nanometer materials

keyword:Pure metal powder

Product Details

Application

Apply to manufacturing the thick-film conductive pastes, such as the pastes for the internal and external electrodes of multi-layered component and circuit board (LTCC), PDP, HIC and solar cell.

Features

  • Good dispersibility
  • Low shrinkage
  • High crystallinity
  • Good electric conductivity
  • Good filling property

Product specification

Specification

Mean Particle Size(μm)

Specific Surface Area(m2/g)

Particle Size Distribution(μm)

Tap Density(g/cm3)

D10

D50

D90

D99

Ag-GB0401

0.38-0.45

1.27-1.50

0.17-0.25

0.45-0.58

0.85-1.02

2.30-2.80

≥4.2

Ag-GB0801

0.82-0.95

0.60-0.70

0.55-0.80

0.90-1.30

1.40-2.80

3.50-6.80

≥4.6

Ag-GB2001

1.80-2.20

0.25-0.32

1.00-1.40

2.00-2.65

3.80-5.20

7.20-10.00

≥5.0

Ag-GB3001C

2.80-3.20

1.75-2.05

1.20-1.60

2.50-3.00

4.35-4.85

8.85-9.35

≥4.0

AgF-GB0801

 

1.30-1.50

0.30-0.60

0.65-0.95

1.30-1.50

3.30-3.70

≥3.3

AgF-GB2001

 

0.80-0.90

1.00-1.30

1.80-2.30

3.50-5.00

7.50-9.00

≥4.0

 

Different specificed products can be customized.

 

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