CuAg-F5001

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Silver-Coated Copper Powder

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Since the establishment, the company has been committed to the prospective development of nanometer materials

keyword：Pure metal powder

Product Details

Application

Apply to HJT conductive silver paste, conductive inks, conductive adhesives, membrane switch and other low or medium temperature conductive pastes, which can replace silver powder.

Product Features

Uniform particle size
Good dispersibility
High anti-oxidation temperature
Good conductivity

Product Specifications

Specification	Mean Particle Size （μm）	Specific Surface Area (m²/g)	Particle Size Distribution （μm）			Ag Content（wt%）
Specification	Mean Particle Size （μm）	Specific Surface Area (m²/g)	D10	D50	D90	Ag Content（wt%）
CuAg-S0501	0.5	1.50-2.50	≤1.00	≤2.00	≤4.00	15-30
CuAg-S1001	2.0	0.45-0.65	≤2.50	≤4.00	≤5.50	10-30
CuAg-S3501	3.5	0.25-0.45	≤3.80	≤6.00	≤9.00	10-30
CuAg-F0501	-	1.90-2.00	≤1.70	≤3.70	≤5.60	15-30
CuAg-F1001	-	0.80-0.95	≤3.20	≤4.80	≤6.30	10-30
CuAg-F3501	-	0.55-0.75	≤3.50	≤5.80	≤7.50	20-30
CuAg-F5001	-	0.35-0.60	≤3.80	≤7.10	≤10.30	10-20