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Since the establishment, the company has been committed to the prospective development of nanometer materials

keyword:Pure metal powder

Product Details

Application

Apply to manufacturing the thick-film conductive pastes, such as the pastes for the internal and external electrodes of multi-layered component and circuit board (LTCC), PDP, HIC and solar cell.

Features

• Good dispersibility

• Low shrinkage

• High crystallinity

• Good electric conductivity

• Good filling property

Product specification

Specification

Mean Particle Size(μm)

Specific Surface Area(m2/g)

Particle Size Distribution(μm)

Tap Density(g/cm3)

D10

D50

D90

Ag-S0500

0.5

0.90-1.20

0.27-0.50

0.60-0.83

0.98-1.44

≥4.10

Ag-S0800

0.82-0.95

0.60-0.70

0.55-0.80

0.90-1.30

1.40-2.80

≥4.6

Ag-S1500

1.5

0.32-0.46

0.75-1.05

1.45-2.15

2.55-4.70

≥5.10

Ag-S2000

1.80-2.20

0.25-0.32

1.00-1.40

2.00-2.85

3.80-6.20

≥5.00

Ag-F0801

 

1.10-1.40

0.30-0.60

0.65-0.95

1.30-1.50

≥4.30

 

Different specificed products can be customized.

 

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